iMX6UL封装形式有哪几种

时间:2017-04-18     作者:


iMX6UL封装形式有哪几种

常用集成电路的封装形式DIP  Dual Inline Package 双列直插式封装FBGA Fine-Pitch  Ball Grid Array  细密球型网数组FTO220 LQFP 微型四方扁平封装PCDIP PQFP Plastic  Quad Flat Package塑料四方扁平封装PSDIP QFP  Quad Flat Package SDIP 双列直插封装SO  Small Outline Package SOP EIAJ TYPE II 14LSmall  Outline Package小型外框封装SOT220small  outline transistor小外形晶体管TO220 TSOP  Thin Small Outline Package 薄型小尺寸封装TSSOP or TSOP II  Thin Shrink Outline Package引脚超薄紧缩小型封装PLCCPlastic  Leaded Chip Carrier  塑料引线芯片载体